This series of blogs looks at the future of the semiconductor industry and the current issues with cost and the resulting stagnation of innovation.  The number of new custom ASICs is shrinking and FPGAs do not totally fill the void when it comes to high performance, power, and RF/analog capability.  Heterogeneous Systems on Chip (HSoC) composed of individual chiplets, fabricated in their optimal processes and connected on a silicon substrate using heterogeneous 2.5D technology, is the future and the technology and business  frameworks are evolving to make this paradigm a reality.

This edition of the blog will discuss different interfaces that are being proposed for use for chiplet interconnection and HSoC construction.  We’ll focus on Intel’s Advanced Interface Bus (AIB) as it provides a number of advantages and takes full advantage of silicon interposers and heterogeneous 2.5D technology.