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ECTC 2021 Features the Hottest Topics and Trends in Microelectronics

For the second time in its 71-year history, ECTC will be presented as a virtual conference, opening Tuesday, June 1, 2021, and close on Sunday, July 4, 2021. Keynotes, plenary sessions, and the special panel focus on the year’s most talked-about trends including:



  • The impact of COVID 19 on the microelectronics industry

  • A chiplet-based future and what it means

  • Market trends and the geo-political outlook

  • The Heterogeneous Integration Roadmap

  • Transitioning to renewable energy

  • ECTC Diversity Panel

  • Virtual Women’s Lunch Panel

  • And more…


ECTC 2021 Technical Program


The ECTC 2021 conference agenda includes over 350 technical papers organized into 46 topical sessions, where each session will be available as an on-demand webcast for the duration of the conference.


The technical program contains papers covering leading-edge developments and technical innovations across the packaging spectrum. Topics include wafer-level and fan-out packaging, 2.5D, 3D and heterogeneous integration, interposers, advanced substrate, assembly, materials modeling, interconnections, packaging for high speed and high bandwidth, photonics, flexible and printed electronics. Special sessions and panels will be available both live and on-demand.


Many of our 3D InCites Community and Advisory Board Members are participating via virtual exhibits or chairing and/or presenting on panels and special sessions. Here is the shortlist:


ECTC 2021 Plenary Session


Transformation of the Electronics Industry in a Post-Covid World

Session Chairs:

E. Jan Vardaman (TechSearch International, Inc.), Mark D. Poliks (Binghamton University) and Kimberly Yess (Brewer Science, Inc.)


Date: June 3, 2021

Time: 11:00 AM EDT

Session sponsored by: 


ECTC 2021 Special Panel


Market Trends and the Geopolitica Outlook

Chaired by Rozalia Beica and Ed Sperling


Date: June 2, 2o21

Time: 8:00 pm EDT


ECTC Special Session


Heterogeneous Integration Roadmap

Session Chairs: Bill Chen – ASE and Bill Bottoms – 3MTS

On-demand/Live Q/A


Heterogeneous Integration uses packaging technology to integrate dissimilar chips, devices, or components with different materials and functions, and from different fabless design houses, foundries, wafer materials, feature sizes, and companies into a system or subsystem. Twenty-three technical working groups will present their areas of expertise. This workshop is a half-day pre-recorded event with a planned follow-up live Q/A session.


Representatives from ASE will also be participating in Special Sessions:



  • Heterogeneous Integration Roadmap: Rising to the Chiplet Challenge

  • Heterogeneous Integration Roadmap: Test in Heterogeneous Integration


Community Member Achievements


Congratulations to:



  • LPKF for its Outstanding Interactive Presentation Paper on “Processing Glass Substrate for Advanced Packaging Using Laser-Induced Deep Etching” By Rafael Santos, Jean-Pol Delrue, Norbert Ambrosius, Roman Ostholt, Stephan Schmidt – LPKF Laser & Electronics AG

  • 25 Years ECTC Volunteer Award:

    J Rao Bonda – Amkor Technology

    Jan Vardaman – TechSearch International

  • 10 Years ECTC Volunteer Award:

    Vikas Gupta – ASE US, Inc.


2021 Virtual Technology Corner Exhibits


ECTC’s Technology Corner will be all virtual and accessible to all conference registrants. This year’s virtual format still provides opportunities for exhibitors and attendees to interact with one another and learn about new technology solutions, applications, and products for the packaging and interconnect industry. Of the 50 plus companies participating, 15 are . Be sure to drop in to chat with:



  • Ajinomoto Fine-Techno USA Corporation

  • ASE Group

  • Brewer Science

  • Deca Technologies Inc

  • EV Group

  • Evatec AG

  • KLA

  • Micross Advanced Interconnect Technology

  • NAMICS Technologies, Inc.

  • Onto Innovation

  • Smoltek

  • SPTS Technologies LTD

  • TechSearch International

  • Xperi


For a complete list of papers being presented in the Technical Program, please visit:


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