Ceva, Beken, and VisiSonics have jointly created a chip-based reference design to add 3D spatial audio to headsets and TWS earbuds. The offering leverages Beken’s BK3288X Bluetooth audio SOC featuring the Ceva-X2 audio DSP running VisiSonics’ RealSpace 3D audio software together with Ceva’s Motion Engine Hear head-tracking algorithms.

Comprising hardware and software, the reference design gives OEMs and ODMs a ready-to-deploy SoC, using any audio-encoding format, to deliver a best-in-class 3D audio hearing experience from virtual reality/augmented reality headsets and the latest motion-aware earbuds. This self-sufficient 3D audio design fully resides on the headset side, not only eliminating the need for a 3D audio-rendering engine on the host device, but also enabling a lower latency design.

The 3D audio reference design is available now directly from Ceva. The associated software package combining VisiSonics’ RealSpace 3D audio with Ceva’s MotionEngine Hear is available now for licensing by Ceva and VisiSonics.

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